April 2023

LEIMSA – Lightweight Electronics by Injection Molding in Seamless Architecture Project was presented with great success at the LOPEC fair (International Exhibition and Conference for the Printed Electronics Industry), in Munich, in March. This printed electronics fair takes place annually and presents innovative solutions in technologies associated with printed electronics on different surfaces, materials and …

LEIMSA Project presented at LOPEC, 2023, Munich, Germany Read More »

Simoldes Plásticos presented LEIMSA Project on the ‘Jornadas de Engenharia Química’ at FEUP . An oral presentation was led by Júlio Grilo from Simoldes Plásticos on a very enthusiastic atmosphere.

Simoldes Plásticos and Celoplás S.A. presented LEIMSA Project on Teckblick 2022 – conference on Printed Electronics and Emerging technologies. An oral presentation was led by Sandra Melo from Simoldes Plásticos and Ana Cortez from Celoplás S.A.. Watch it here: Printed, Hybrid, InMold, and 3D Electronics | MAR 2022 (techblick.com)