LEIMSA Project presented at LOPEC, 2023, Munich, Germany

LEIMSA – Lightweight Electronics by Injection Molding in Seamless Architecture Project was presented with great success at the LOPEC fair (International Exhibition and Conference for the Printed Electronics Industry), in Munich, in March. This printed electronics fair takes place annually and presents innovative solutions in technologies associated with printed electronics on different surfaces, materials and products. Some printed electronics technologies can already be found in the biggest car manufacturers and some household appliances, and it is foreseen their mass massification in the coming years to replace the traditional buttons and revolutionize the driving experience. An intermediary demonstrator prototype of a car center console was presented, which includes the parts developed by Simoldes and Celoplás with the technologies of IMD – In Molde Decoration, IML- In Mold Labeling and IME – In Mold Electronics with the support of all other consortium members: DTx Colab, BOSCH, University of Minho and Ceiia.