Lightweight Electronics by Injection Moulding in Seamless Architecture
Project Aim
What we commit to achieve
LEIMSA addresses the development of disruptive components for the interior of the vehicle of the future with purpose of following the market evolutive trends in the automotive industry and anticipate materialization.
In the results, will be integrated decorative elements and distinctive functionalities with the least possible operations, using emergent technologies in the mould (in-mould operations) and lightweight, such as In-Mould Decoration (IMD), In-Mould Labeling (IML), High Pressure Forming (HPF) and In-Mould Electronics (IME), for the development of intelligent and haptic surfaces, with attractive 3D seamless design and a Human-Machine Interface (HMI) that will be immersive and intuitive, centered in the user experience.
LEIMSA also aims at the capacitation of the consortium as well as the creation of robust value chain.
Specific Objectives
Centered in the applied R&D development and knowledge transfer of determined areas.
01. In-mould electronics & decoration
Printed and embedded in the product.
02. Lightweight
Product and concept design.
03. Systems
Haptic feedback, illumination and sensorization.
04. HMI | UI | UX
Human-machine interfaces.
05. Manufacturing processes
Optimization and integration
of technologies for functional components.
06. Quality control
Of the product functionality along the process.
Disruptive auto interior
with design flexibility
of printed and hybrid
electronics by IME
Attractive, intuitive
and immersive HMI
of operations in
the production process
Innovation Outcomes
Innovation Outcomes
Disruptive auto interior
with design flexibility
of printed and hybrid
electronics by IME
Attractive, intuitive
and immersive HMI
of operations in
the production process
UI/UX Concept
Project Results
Final LEIMSA demonstrator and project video
The LEIMSA Project was presented at the Simoldes Tryout Center on October 4th during the final TechDay. The LEIMSA team worked hard and it was a proud moment to showcase the culmination of the consortium’s efforts in advancing innovation and technology within the automotive industry. The LEIMSA project represents a significant leap in the development of disruptive components for the interior of the vehicle of the future. The entire team is immensely grateful for the support, dedication and hard work that was needed to make the LEIMSA project a reality, especially during the final TechDay event. We could not have …
Intermediate Demonstrator of LEIMSA
The second Milestone of the project was achieved in February 2023 with the construction and presentation of the intermediate demonstrator of the concept developed. This intermediary Demonstrator was constructed using several diferent technologies: IMD, IML, IME, traditional PCB construction and prototyping technologies. It is an impressive real size demonstrator of the L-console that will be assembled on the final demonstrator. This Demonstrator is functional and integrates a touch display, capacitive touch buttons, a capacitive slider, backlighting and haptic feedback as an excelent experience of a Lightweight and Seamless design on a future autonomous driving car. For more details visit the: …
Concept in Development and LEIMSA’s first iteration mockup
The first Milestone of the project was achieved in October 2021 with the construction and presentation of the first interaction mockup of the concept developed. This preliminary mokcup was constructed using several prototyping technologies at CEIIA and is an impressive real size demonstrator of the final concept. This Mockup is a result of several studies that takes into account the technologies that are being explored in the project and will be presented in the final concept. With this first milestone it has been possible to evaluate ergonomics aspects, UX and UI studies and the experience of a Lightweight and Seamless design …
Partners
Consortium body and total investment
News
LEIMSA Project presented at LOPEC, 2023, Munich, Germany
LEIMSA – Lightweight Electronics by Injection Molding in Seamless Architecture Project was presented with great success at the LOPEC fair (International Exhibition and Conference for the Printed Electronics Industry), in Munich, in March. This printed electronics fair takes place annually and presents innovative solutions in technologies associated with printed electronics on different surfaces, materials and …
LEIMSA Project presented at LOPEC, 2023, Munich, Germany Read More »
LEIMSA Project presented at FEUP – Jornadas de Engenharia Química
Simoldes Plásticos presented LEIMSA Project on the ‘Jornadas de Engenharia Química’ at FEUP . An oral presentation was led by Júlio Grilo from Simoldes Plásticos on a very enthusiastic atmosphere.
LEIMSA Project presented at Teckblick 2022
Simoldes Plásticos and Celoplás S.A. presented LEIMSA Project on Teckblick 2022 – conference on Printed Electronics and Emerging technologies. An oral presentation was led by Sandra Melo from Simoldes Plásticos and Ana Cortez from Celoplás S.A.. Watch it here: Printed, Hybrid, InMold, and 3D Electronics | MAR 2022 (techblick.com)
LEIMSA Project at the Hannover Messe 2022
Simoldes Plásticos and Celoplás S.A. were present at the Hannover Messe 2022 Fair, which had Portugal as a partner country. The dissemination of the project was carried out from the stands of the two companies through the presentation of roll-ups, flyers and film of the project and preliminary real prototypes, as a way of sharing …
Automotive Interiors EXPO 2021
Researchers from the Collaborative Laboratory in Digital Transformation – DTx and CEIIA attended at Automotive Interiors Expo 2021 Europe, within the scope of the activity to promote and disseminate the results of the LEIMSA project. The dissemination of the project was carried out through the presentation of the roll-up containing the results of the project …
Workshop LEIMSA – Autoeuropa
In October 2021, the first project workshop was held to present the first results of the project to the consortium and to VW AutoEuropa. Posters and technical information relevant to project execution, value chain development, prototypes under development and an intermediate mockup of the final console were presented. It was possible to experience the model and the …
